RoHS-Compliant Components Feature .050” Center Spacing and Are Available to Withstand 150 Degrees C Continual Heat

San Marcos, CA, June 30, 2007 - Sullins Electronics, a global leader in the design and manufacture of 100% RoHS-compliant board level interconnect products, today announced the expansion of their connector offering specifically engineered for use in high temperature applications. The new bi-level card extenders are the latest addition to the Company’s growing portfolio of edgecards expressly designed to satisfy the requirements of high pin count, high-temperature applications where space is limited. Boasting .050” (1.27 mm) contact center spacing, the devices are an ideal replacement for .100” (2.54 mm) center spacing parts as their employment doubles the number of contacts within the same area while ensuring the reliability and integrity of connectors’ electrical performance. Their construction features both primary and secondary engagement contact areas, with the second area recessed within the card slot. Moreover, parts may be ordered in straight or right angle versions to enable the utmost in design flexibility.

BI-LEVEL CARD EXTENDERS

Manufactured with BeCu (beryllium-copper) pins with PPS/PA97 insulators for -65 degrees C to 150 degrees C applications, or with phosphor bronze pins with PPS/PA9T insulators for applications requiring an operating temperature range of -65 degrees C to 125 degrees C, Sullins’ new series facilitates the interconnection of 0.062” +/- .008” daughtercards. As such, parts may be confidently specified for use in burn-in ovens, as well as in backplanes, power converters, and power supplies in applications including communications, medical equipment and instrumentation, and automotive R&D.

The series is recognized under the Component Program of UL and C-UL, and is provided with from 6 to 100 contact positions. Additional features include an insulation resistance of 5,000 Megaohms minimum at 125 VDC, a single contact current rating of 3 Amps, and a signal contact normal force of 0.75N (75 grams). Customers further have their choice of a wide variety of mounting options, and selective or full plating. Devices are engineered for conventional reflow soldering to optimize manufacturing efficiencies and reduce products’ time-to-market. Delivery is 2 to 3 week ARO, samples are immediately available.

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